Solicitation for Input for IPC-2581 RevC

Last year was a watershed year for the IPC-2581 standard. A broad cross-section of printed circuit board software suppliers, OEMs, equipment suppliers, manufacturers, and service suppliers, having implemented IPC-2581 both in trial and in production use, provided significant positive feedback to the IPC 2-16 committee regarding their experiences utilizing the standard to produce PCB products. Working closely with the IPC-2581 Consortium's Technical Committee many of these adopters proposed feature enhancements leading to IPC-2581B Amendment 1, published in January of this year. This release supports the most comprehensive set of industry requirements for printed circuit board fabrication, assembly, and test in a data-centric, open, license-free, industry driven standard format. On behalf of the IPC 2-1-6 Committee I would like to extend our sincere gratitude to all who participated in this effort. That stated, we recognize there is still more work to be done.

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Ballot for IPC-2581 B Amendment 1 Passes

It was announced at the IPC-2581 Consortium Technical Committee Meeting on June 29th, that the Ballot process for the approval of “IPC-2581B Amendment 1” had met the requirements for approval with a more the 90% participant vote, all of which were in the affirmative. The ballot officially closed on July 6 whereby IPC-2581B Amendment 1 was declared “Approved”. Again, the effort put forth by the IPC-2581 Consortium Technical Committee, in conjunction with the IPC 2-16 Laminate Sub-committee, and the IPC 2-40 Electronic Documentation Sub-committee has succeeded in improving and adapting the IPC-2581 format to support the growing technology and information requirements in the Design to Manufacturing process. The IPC-2581 specification document and schema are now in the process of preparation for publication.

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IPC-2581 Consortium at IPC-APEX EXPO 2016

At this year’s IPC-APEX EXPO, we saw a drastic shift on subject of IPC_2581 from “Why IPC-2581?” to “How can I leverage the format today across the supply chain?”. This was apparent with the questions we received after Gary Carter from Fujitsu delivered an exciting case study on how we realized a complete augmented utilization of IPC-2581 to drive a project from design to manufacturing, including assembly. There was sincere interest during the Design Forum on how to get started on using IPC-2581, and how to motivate more members of the supply chain to accelerate adoption. We also covered how IPC-2581 can be used to facilitate the documentation process, along with conducting upfront design validation before sign-off to manufacturing using simulation and analysis tools. With the new enhancements coming from the latest revision, along with new inputs, we are proving that IPC-2581 is a viable option to drive the manufacturing process. 

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IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

BANNOCKBURN, Ill., USA, April 5, 2016 — The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

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