IPC APEX Expo 2013


IPC APEX EXPO is the largest electronics assembly exhibition and event in North America, which attract over 8900 visitors from more than 50 countries featuring advanced and emerging technologies in PCB design, manufacturing, assembly and test.

 

 IPC-2581 Consortium Booth #2439                       

 Visit IPC-2581 Consortium booth #2439, to see the IPC-2581 adoption progress made since the APEX show last year. The IPC-2581 data will be output from Cadence and Zuken’s PCB Design tools, and then consumed by tools from ADIVA, Downstream Technologies, WISE Software for DFM checking, viewing and documentation.

At the Consortium’s booth, you will also see the first PCB in the industry fabricated by transferring the design data to manufacturing in the IPC-2581 format. Phil Wain, the Senior engineer of CC Electronics (manufacturer of this board) said: “The time spent on this design was 30 percent less compared to similar designs using traditional, multiple file formats to describe the PCB design.”


Consortium members at IPC APEX Expo

 Stop by and talk with consortium member representatives from system companies, EDA companies, DFM software companies and manufacturing companies to know why it’s worth the effort to support this global neutral standard.

 IPC-2581 Consortium – Booth #2439

Aegis Softwares – Booth #527

Polar Instruments – Booth #2119

Sanmina – Booth #209

Siemens PLM Software – Booth #111

Ucamco USA – Booth #2114

 

IPC-2581 Presentations & Meetings

Don’t miss the presentations and IPC Standards Development Committee meetings about IPC-2581.

Presentations:


Monday, Feb 18, 8:00 am-8:30 am

Roadmapping for Design

Speaker: Dieter Bergman, IPC Director of Technology Transfer, IPC

 

Monday, Feb 18, 8:30 am-9:15 am

Efficient Design Data Transfer to Manufacturing Using IPC-2581

Speaker: Ed Acheson, Principal Product Engineer, Cadence Design Systems

 

IPC Standards Development Committee meetings:

 

Monday, Feb 18, 1:30 pm- 5:00 pm

Product Data Description (Laminar View) Subcommittee (2-16)

Presenters/Chairs: Karen McConnell CID, Chairman, Northrop Grumman Corporation

 

Tuesday, Feb 19, 10:00 am – 12:00 pm

Electronic Documentation Technology Committee (2-40)

Presenters/Chairs: Karen McConnell CID, Chairman, Northrop Grumman Corporation

 

Who should attend:

PCB Designers, Engineers, Fabricators, Assemblers

Further information:

IPC-2581 Trims Fabrication Time by 30%

IPC-2581 Consortium APEX EXPO Booth Map

IPC APEX EXPO

IPC-2581 Consortium